Product Description

• CONAP®  CE-1170 is a solvent-based, single component, fast curing, acrylic resin solution

Areas of Application

• CONAP® CE-1170 provides an excellent electrical and moisture barrier for thin film applications on components and printed circuit boards.

Features and Benefits

• ·  QPL listed for MIL-I-46058C for Type AR
• IPC-CC-830B qualified
• Halogen-free (IEC 61249-2-21)
• Excellent hydrolytic stability
• UL94 V-0 listed
• Flexible coating
• Excellent   adhesion to phenolic laminates and epoxy-glass
• Excellent reparability
• Tracer dye added for inspection under UV lighting

Application Methods

• Spray Coating
• Dip Coating
• Brush Applied

Transportation / Storage

• Store below 25°C / 77°F in a dry controlled environment out of direct sunlight. This material should be suitable for use stored under these conditions in the original sealed containers for twelve (12) months from the date of shipment.
• Failure to store the product as recommended above may lead to deterioration in product performance.
• This product is sensitive to moisture and atmospheric humidity. Containers, once opened, should be used immediately or blanketed with dry air or nitrogen (CONAP® Dri-Purge) before resealing.

Health / Safety

• Refer to the Safety Data Sheet for additional information.

More

Issue Time:		2025-11-08
Expire Time:		2025-12-07