Product Characteristic：

Process Technique: 1 layer, 2 layers, 4 layers, 6 layers, 8 layers, Multilayer

Base Material

• Halogen Free

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Board thickness

• Halogen Free: 0.4~3.0mm

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Copper thickness

• 0.5oz(18µm) 
  
• 1oz(35µm) 
  
• 2oz(70µm) 
  
• 3oz(105µm) 
  
• 4oz(141µm) 
  
• 5oz(176µm) 
  
• 6oz(211µm)

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Minimum Line width/space

• Finished copper thickness within 1oz : 100 / 100µm 
  
• Special: 75 / 75µm 

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Solder Mask

• Liquid photoimageable solder mask : Green gloss (matt), White, Black, Gray, Red 
  
• PC solder mask: Green gloss (matt), Black

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Available Finishes

• HAL 
  
• Lead Free HAL 
  
• OSP 
  
• Immersion Gold 
  
• Carbon 
  
• Immersion Silver 
  
• Electroplated Gold

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Outline Contour

• Routing: General tolerance: ±0.15mm, Special tolerance: ±0.1mm 
  
• V-cut : Angle 30˚, 45˚, 60˚ 
  
• Stamp holes　

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Min. hole size 

• 0.25mm

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Special Process

• Laser drilling 
  
  

Issue Time:		2024-05-03
Expire Time:		2024-09-05