Base Material

• CEM-3

Board thickness

• CEM-3:0.8~1.6mm

Copper thickness

• 0.5oz(18µm) 
  
• 1oz(35µm) 
  
• 2oz(70µm) 
  
• 3oz(105µm) 
  
• 4oz(141µm) 
  
• 5oz(176µm) 
  
• 6oz(211µm)

Minimum Line width/space

• Finished copper thickness within 1oz : 100 / 100µm

Solder Mask

• Liquid photoimageable solder mask : Green gloss (matt), White, Black, Gray, Red 
  
• PC solder mask: Green gloss (matt), Black　

Available Finishes

• HAL 
  
• Lead Free HAL 
  
• OSP 
  
• Immersion Gold 
  
• Carbon
• Immersion Silver 
  
• Electroplated Gold 

Outline Contour

• Routing: General tolerance: ±0.15mm, Special tolerance: ±0.1mm 
  
• Punching: tolerance ±0.1mm 
  
• V-cut : Angle 30˚, 45˚, 60˚  
  
• Stamp holes

Min. hole size

• 0.25mm