Alloys: Sn/Ag0.3/Cu0.7
ULF series is a new Pb-free solder paste using very low oxide-level spherical Pb-free solder powder mixed with specially developed high technical Pb-free flux without washing. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent resolution and reliability can also be obtained during continuous printing. It is under IEC Halogen free standard, RoHS standard and American PrEn14582 standard.

Issue Time:		2026-09-09
Expire Time:		2027-06-21