AOI Automatic Optical Inspection
WaferEye810, designed for 8-inch wafers, is an advanced system devoted to the precise detection of surface defects on wafers, ensuring high-quality inspection. Through the integration of cutting-edge optical systems and advanced image processing techniques, this system excels in detecting surface defects as small as 10 x 10 µm in size, including scratches, breakages, cracks, abnormal PADs, and more. Intelligent software enables real-time image display and defect analysis, automatically documenting the coordinates of abnormal die chips along with defect details. This prevents flawed die chips from progressing to the next process, effectively reducing the risk of production costs.
The system's flexibility extends to customization, accommodating specific customer needs for inspection projects. It allows seamless adjustment of parameters for unique processes and product requirements, ensuring thorough inspection and enhanced detection rates. Opting for customized projects provides a tailored solution, ultimately elevating production efficiency.
Choosing our WaferEye810 inspection system signifies a commitment to both high quality and efficiency. Let's collaborate to lead the way in pioneering a new era of AOI inspection!
Features
- Utilizes Line Scan detection method, supporting wafers of up to 8 inches in size
- Equipped with a high-resolution 2.8 µm camera for clear capture of surface defects on wafers.
- Detects defects with a minimum size of around 10 x 10 µm.
- Capable of inspecting surface defects before and after wafer cutting.
- Capable of detecting defects on the wafer surface and bonding pads (PAD), with subsequent defect analysis.
- Adaptable to different industry requirements, allowing for the replacement or addition of inspection items.
- Equipped with a high-performance computer and a touch screen, ensuring convenient operation and real-time image inspection.
- Intuitive intelligent software enhances operational efficiency and maintenance.
- Supports offline inspection, providing flexibility to meet the demands of various production lines.
WaferEye810 Brochure
Specifications
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Inspection Wafer Type: Wafer Glass Substrate
Inspection Wafer Size: ≦ 8-inch wafer
Inspection Defects: Wafer: Scratch, Chipping, Crack；PAD: Discoloration, Contamination, Deformation
Detection Size: 10 x 10 um (Min.)
Inspection Light Source: LED
Image Capture Device: Line Scan Camera
Resolution: 2.8 um/pixel
Tact Time: 500 sec./pcs (8-inch)
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Inspection Equipment: WaferEye810
Inspection Software: Defect Inspection System
Equipment Dimensions: 170 x 130 x 220 cm
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