Magntek Electronic Inc.
Diamond Member

Magntek Electronic Inc.

Heatsink Chipset

Back to Products List       Add to Basket

Heatsink Chipset

Heatsink Chipset

Product Parameters

Product Name Heatsink Chipset
Item No. HC373725P
Supply Type Sell
Category Industrial Supplies Hardware > Mechanical Parts > BGA Heatsink

Detailed Product Description

FPGA aluminum heatsink 
  1. Material: Extruded Aluminum 6063-T5
  2. Aluminum BGA’s FPGA heatsinks for chipset
  3. Cool PCI/AGP Chip Sets devices
  4. Optional thermal pad: 3M-9448B/SEKISUI 5760/TM100B
  5. Chomerics T725 with Sponge assembled
  6. CHIPS IC radiators/CNC machining
  7. Integrated circuits like Ball Grid Arrays
  8. Specification: according to customers drawings.
  9. Hundreds of standard aluminium heatsinks profile
  10. Surface Finishing: black anodized, chromate, cleaning
  11. Dimensions: Width x 37mm Height x 25mm
  12. Weight: 37g per piece
  13. Package: standard export cartons.
  14. Origin: Made In Taiwan
  15. RoHS Quality & ISO 9001 Certificate
A standard line of heat sinks is available for BGAs, PGAs, and similar packaged devices. Applications include network routers and switches, high-resolution printers, embedded computer, signal board, PC-104 board and global positioning systems (GPS).

Keywords: BGA Heatsink  Heatsink Chipset   

Enquire Now!
Company Name Magntek Electronic Inc.
Country/Region Taiwan
City New Taipei City
Address 17F.-11, No. 137, Sec. 1, Zhongzheng E. Rd., Tamsui Dist.,
Zip / Postal Code 25147
Telephone +886-2-26265758
Fax +--
Contact Person