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PCB Manufacturing-2

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PCB Manufacturing-2

PCB Manufacturing-2

Product Parameters

Product Name PCB Manufacturing-2
Item No. 7-2
Supply Type Sell
Category Electronic,Electrical > Electronic Component > PCB Manufacturing

Detailed Product Description

Panel: Cut the copper foil substrate to the Panel Size for each station process.

Inner layer circuit etching: Before the substrate is pressed, the copper foil on the copper surface is usually roughened by brushing, micro-etching, etc., and the dry film photoresist is closely attached to it at an appropriate temperature and pressure. . The substrate with the dry film photoresist is sent to the ultraviolet exposure machine for exposure, and the photoresist is polymerized after being irradiated with ultraviolet rays in the light transmitting region of the film, and the image on the film is transferred to the dry film photoresist on the surface of the plate. . After the protective film on the film surface is torn off, the unexposed area on the film surface is developed and removed, and the exposed copper foil is etched away to form a line. Finally, the dry film photoresist that has been retired is washed away.

Test: Use Automated Optical Inspection (AOI) - Visual inspection of the planar appearance of the board surface using normal or laser light with a computer program.

Pressing: The finished inner circuit board must be bonded to the outer layer copper foil with fiberglass resin film. Before pressing, the inner layer needs to be blackened (oxygenated) to increase the insulation of the copper surface passivation; and the copper surface of the inner layer is roughened to produce good adhesion to the film.

Drilling: The board is drilled with a CNC drill to drill the vias of the interlayer circuit and the fixing holes of the soldered parts. When drilling, use a plug to fix the circuit board to the drilling machine table through the previously drilled target hole, and add a flat bottom plate (phenolic resin board or wood pulp board) and an upper cover (aluminum board). Reduce the occurrence of borehole hair.

Plated through hole primary copper: After the interlayer via is formed, a metal copper layer is required to be formed thereon to complete the conduction of the interlayer circuit. First clean the pores on the hole and the dust in the hole by heavy brushing and high-pressure rinsing, and then remove the slag on the copper surface of the hole wall. The cleaned pore wall is soaked and adhered to the palladium-gel layer and then reduced to metal palladium. The circuit board is immersed in the chemical copper solution, and the copper ions in the solution are reduced and deposited by the catalytic action of the palladium metal to adhere to the hole wall to form a through-hole circuit. The copper layer in the via hole is then thickened to a thickness sufficient to withstand subsequent processing and environmental impact.

The outer layer of secondary copper: in the production of line image transfer is like the inner layer circuit, but in the line etching is divided into two production methods: positive film and negative film. The negative film is produced in the same way as the inner layer. After the development, the copper is directly etched and the film is removed. The positive film is produced by adding secondary copper and tin-lead after development (the tin-lead in this area will be retained as an etch stop in the later copper etching step), and the film is alkaline after removing the film. A mixture of ammonia water and copper chloride corrodes the exposed copper foil to form a line. Finally, tin-lead stripping solution is used to strip the tin-lead layer that has been retired. (In the early days, the tin-lead layer was preserved. After heavy-duty, it was used to cover the line as a protective layer.

Anti-weld green paint: After the outer layer is completed, it needs to be covered with an insulating resin layer to protect the circuit from oxidation and short circuit.

Text printing: The text, trademark or part number required by the customer is printed on the board by screen printing, and then the text paint is hardened by hot baking (or ultraviolet irradiation).

Surface treatment: The anti-weld green paint covers most of the copper surface of the circuit, and only exposes the terminal contacts for soldering, electrical testing and board insertion. This endpoint requires an additional protective layer to avoid oxides at the terminals of the anode (+) that are connected during long-term use, affecting circuit stability and creating safety concerns.
Electrical test: There are several test methods: 1: AOI SCAN 2: flying probe test 3: open test fixture
Mainly test PCB system with or without open circuit / short circuit (O / S)

Impedance Control : Divided into 1: Single-Ended Impedance Control 2: Differential Impedance Control

Molding and cutting: Cut the board into a CNC molding machine (or die punch) to the customer's desired size. When cutting, the plug is fixed on the bed (or mold) through the previously drilled positioning hole. .
Final inspection packaging: The final electrical conduction, impedance test and solderability and thermal shock resistance test of the board before packaging. And with appropriate baking to eliminate the moisture and accumulated thermal stress of the board during the process, and finally packaged in a vacuum bag.

Keywords: PCB Manufacturing   

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Country/Region Taiwan
City New Taipei City 235
Address 3F., No.663, Bannan Rd., Zhonghe Dist.
Telephone +886-2-77313777
Fax +886-2-22256511
Contact Person