Alloys: Sn/Ag3.0/Cu0.5
ULF series is a new Pb-free solder paste using low oxide-level spherical Pb-free solder powder mixed with developed high technical Pb-free flux without washing. Without Pb, it will contribute to the protection of global environment. Besides, excellent resolution and reliability can also be obtained during continuous printing. With IEC Halogen free standard, RoHS standard and American PrEn14582 standard.