NiCr target

The manufacture of silicide and alloy targets far more homogeneous and finer in structures than conventional products is now possible. In the case of silicide targets, metal silicide sputtering targets of homogeneous, fine crystal structures with free silicon phases 5 .mu.m or smaller in size and with oxygen concentrations of 500 ppm (by weight) or less that have been difficult to fabricate conventionally can now be made. Since the particle problem is overcome while contamination with oxygen is lessened, potential future requirements for further homogeneity and fineness of target crystal structures will be met.

Specification:

Application: optical thin films .protect film
Customization specification