4-layered PCB assembly
PCB material: FR4
Size: 100 x 69mm
Thickness: 1.6mm
Surface finishing: immersion gold
SMT process: lead-free
BGA quantity: 1
IC quantity: 16
Board used in: computers
PCB capability:
Material used: FR4, high Tg minimum 170°C, hi-frequency
Metal based: aluminum and more
Maximum panel size: 26 x 26 inches (660 x 660mm)
Line width and spacing:
Minimum trace width/space: (internal) 4mil (0.1 mm)
Minimum trace width/space: (external) 4mil (0.1 mm)
Layer count and thickness: 2 to 12 layers
Via drill size: minimum drill hole diameter: 10mil (0.25 mm)
Minimum via size: 8mil (0.1 mm)
Micro via: 4mil (0.1 mm)
Solder mask: solder mask bridge between solder dam 3mil (0.07 mm)
Warpage: 0.5 %
Impedance: ±10%
Surface finish: hard gold/ENIG/HASL/carbon ink/OSP (ENTEK CU 106 AX)/immersion tin
Minimum SMT pitch: 12 mil (0.2 mm)
Minimum parts footpins: 0201
Products involved fields: consume electronics, medical equipments, industrial commands, communications, auto parts and more
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| Issue Time: |
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2010-01-04 |
| Expire Time: |
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2011-01-04 |
