Meterial：FR4 Thickness: 1.6mm Surface finishing :HASL Green soldermask Total components:102 Offer:SMT DIP COB BGA Assembly Test:E-testing,functional test,AOI and re-BGA Our capacity: Surface Mount Technology Single/Double Sided SMT Minimum chip size component: 0201 Standard chip size component: 0603 and larger ICs - SOICs, SSOPs, QFPs Fine Pitch ICs : pitch less than 0.021 BGAs, uBGA Convection & IR Reflow Solder Through Hole (TH) Manual Insertion Automated Pin Insertion Manual Soldering Wave&re-flow Soldering Test:functional, ICT, Flying Probe, test programming, cable scan,AOI x-ray inspection,BGA rework device No MOQ We will reply you within 5hours,and quote to you within 3 working days. Contact:samire@stgpcba.com MSN:stg-sales01@hotmail.com skype:stgpcba