HDI PCB Layers: 2 Made of FR-4 Thickness: 1.0mm RoHS and UL standards Line width: 0.12mm (minimum) Line space: 0.12mm (minimum) Hole: 0.16mm Surface processing: gold plating Green solder mark Our PCB capability: Material used: FR-4 High-TG: 170C (minimum) Hi-frequency Metal based: aluminum and more Maximum panel size: 26 x 26 inches (660mm x 660mm) Line width and spacing: Minimum line width (internal): 4mil (0.1mm) for mass production and 3mil for samples Minimum line width (external): 4mil (0.1mm) for mass production and 3mil for samples Minimum line spacing (external): 4mil (0.1mm) for mass production and 3mil for samples Layer count and thickness: 2 to 12 layers Minimum thickness: Two layers: 4mil (0.1mm) Four layers: 12mil (0.3mm) Six layers: 16mil (0.4mm) Eight layers: 24mil (0.6mm) Ten layers: 200mil (5.0mm) Layer to layer registration: ±5mil (0.13mm) Via/drill size: minimum drill hole diameter 10mil (0.25mm) Minimum via size: 8mil (0.2mm) Hole to hole tolerance: ±3mil (0.08mm) Hole to edge tolerance: ±5mil (0.13mm) Micro via: 4mil (0.1mm) Solder mask: solder mask bridge between solder dam 3mil (0.07mm) War page: 0.5% Impedance: ±10% Surface finish: hard gold/ENIG/HASL/carbon ink/OSP (ENTEK CU 106 AX)/immersion tin Minimum SMT pitch: 12mil (0.2mm) Minimum parts foot pins: 0201 Products involved fields: consumer electronics, medical equipments, industrial commands, communications, auto parts and more