multilayer pcb assembly PCB material: FR4 Size: 106 x 98mm Thickness: 1.6mm Surface finishing: immersion gold SMT process: lead-free BGA quantity: 1 IC quantity: 16 board used in: computers PCB capability: Material used: FR4, high Tg minimum 170°C, hi-frequency Metal based: aluminum and more Maximum panel size: 26 x 26 inches (660 x 660mm) Line width and spacing: Minimum trace width/space: (internal) 4 mil (0.1 mm) Minimum trace width/space: (external) 4 mil (0.1 mm) Layer count and thickness: 2 - 12 layers Via drill size: minimum drill hole diameter: 10 mil (0.25 mm) Minimum via size: 8 mil (0.1 mm) Micro via: 4 mil (0.1 mm) Solder mask: solder mask bridge between solder dam 3 mil (0.07 mm) Warpage: 0.5 % Impedance: ±10% Surface finish: hard gold/ENIG/HASL/carbon ink/OSP (ENTEK CU 106 AX)/immersion tin Minimum SMT pitch: 12 mil (0.2 mm) Minimum parts footpins: 0201 Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts and more