PCB Craft Ability Introduction Item For the batch For the prototype Layer（Maximum） 2-18 20-30 Board material type FR-4, Ceramic substrate board，Aluminum based board,、High-Tg PTFE，PPO ，PPE Rogers, etc E-65，etc. Compound material lamination 4layer—6layer 6 layer—8layer Maximum dimension 610mm X 1100mm Dimension tolerance ±0.13mm ±0.10mm Board thickness coverage 0.2mm--6.00mm 0.20mm--8.00mm Board thickness tolerance ( t≥0.8mm) ±8% ±5% Board thickness tolerance(t＜0.8mm) ±10% ±8% DK thickness 0.076mm--6.00mm 0.076mm--0.100mm Min line width 0.10mm 0.075mm Min line space 0.10mm 0.075mm Out layer copper thickness 8.75um--175um 8.75um--280um Inner layer copper thickness 17.5um--175um 8.75um--175um Drilling hole diameter (Mechanical drill) 0.25mm--6.00mm 0.15mm--0.25mm Finished hole diameter (Mechanical drill) 0.20mm--6.00mm 0.10mm--0.20mm Hole diameter tolerance4 (Mechanical drill) 0.05mm Hole position tolerance (Mechanical drill) 0.075mm 0.050mm Laser drill hole size 0.10mm 0.075mm Board thickness and hole diameter ratio 10:1 12:1 Solder mask type GGreen、Yellow、Black、Purple、Blue、White, Red Minimum Solder Mask Dam 0.10mm 0.075mm Minimum size of solder mask separation ring 0.05mm 0.025mm Solder mask oil plug hole diameter 0.25mm--0.60mm 0.60mm-0.80mm Impedance control tolerance ±10% ±5% Surface finish Hot Air Level、ENIG、Immersion silver、Gold plating, Immersion tin、Gold Finger Immersion Tin，OSP