pcb assembly Number of layers: 4-layer Base material: Tg 170C Copper thickness: 1oz Board thickness: 1.6mm Minimum hole size: 0.1mm Minimum line width: 0.1mm Minimum line spacing: 0.12mm Surface finishing: immersion gold Our PCB capability: Materials used: FR4, high Tg minimum 170C, high frequency Metal based: aluminum and more Maximum panel size: 26 x 26-inch (660 x 660mm) Line width and spacing: Minimum line width (internal): 4mil (0.1mm) for mass production and 3mil for samples Minimum line width (external): 4mil (0.1mm) for mass production and 3mil for samples Minimum line spacing (external): 4mil (0.1mm) for mass production and 3mil for samples Layer count and thickness (2 to 12 layers): Minimum thickness (2 layers): 4mil (0.1mm) Minimum thickness (4 layers): 12mil (0.3mm) Minimum thickness (6 layers): 16mil (0.4mm) Minimum thickness (8 layers): 24mil (0.6mm) Maximum thickness (10 layers): 200mil (5.0mm) Layer to layer registration: ±5mil (0.13mm) Via/drill size: minimum drill hole diameter 10mil (0.25mm) Minimum via size: 8mil (0.2mm) Hole to hole tolerance: ±3mil (0.08mm) Hole to edge tolerance: ±5mil (0.13mm) Micro via: 4mil (0.1mm) Solder mask: solder mask bridge between solder dam 3mil (0.07mm) Warp: 0.5% Impedance: ± 10% Surface finish: hard gold/ENIG/HASL/carbon ink/OSP (ENTEK CU 106 AX)/immersion tin Minimum SMT pitch: 12mil (0.2mm) Minimum parts foot-pin: 0201 Products involved fields: consumer electronics, medical equipments, industrial commands, communications, auto parts and more